► High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste September 19th, SMTA International, 2017

Presentations

► High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste September 19th, SMTA International, 2017

► “The Future of Solder Joint Encapsulant Adhesives,” October 29th, IMAPS 2015

► “A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications,” September 29th, SMTAI 2015

► “An Overview of Advanced Materials,” May 27th, ECTC 2015

► “The Future of Solder Joint Encapsulant Adhesives,” February 23rd, IPC APEX EXPO 2015

► “The Future of Solder Joint Encapsulation,” March 20th, IMAPS New England Expo 2015

► “The Future of Solder Joint Encapsulation,” October 24th, IPC Tech Summit 2014

► “Solderable Anisotropic Conductive Adhesives for 3D Package Applications,” October 21st, International Symposium on Microelectronics 2014

► “An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates,” October 9th, SMTAI 2014

► “A High Thermal Conductive Solderable Adhesive,” April 30th, IMAPS Workshop at CNSE, 2014

► “Solder Joint Encapsulate – Miniaturization Solution,” March 25-27th, APEX 2014

► “A Novel High Thermal Conductive Underfill for Flip Chip Application” and “Solder Joint Encapsulant Adhesive – LGA High Reliability and Low Cost Assembly Solutions,” October 1st-3rd, IMAPS 2013

► “A Novel Underfill for 3D TSV Package” and “Solder Joint Encapsulate Adhesive – PoP TMV High Reliability and Low Cost Assembly Solution,” April 30th-May 1st, IMAPS workshop 2013

► “Solder Joint Encapsulant Adhesive – PoP Assembly Solution,” August 29th, NEPCON 2012

► “Gold Replacement – Nanofilm for Oxidation Barrier,” June 14th, IMAPS workshop 2012

► “Innovative Rework Solution to Assembled IC Components,” October 12-20th, SMTA 2011

► “A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive” and “A Low Cost and High Thermal Conductive Solderable Adhesive,” October 9-13th, IMAPS 2011

► “A Low Cost Manufacturing Solution – Low Temperature Super-Fast Cure and Flow Reworkable Underfill,” July 13th, SEMICON West 2011

► “A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive” and “A Low Cost and High Thermal Conductive Solderable Adhesive,” May 3rd, IMAPS 2011

► “Underfill for Ultra-Low Bumped (10u) 3D TSV Package” and “A First Individual Solder Joint Encapsulant Adhesives,” November 3rd-4th, IMAPS 2010

► “World First Solder Joint Encapsulant Adhesives,” August 31st, NEPCON 2010

► “A First Individual Solder Joint Encapsulant Adhesives,” July 14th, SEMICON West 2010

Technical Poster

► “A First Individual Solder Joint Encapsulant Adhesives,” IMAPS 2010