Die Attach Adhesive

The YINCAE DA 90 series features solvent-free low temperature conductive or insulating die attach adhesives. This series offers excellent adhesion to both the substrate and bare die, can be used for small and large die attachments and can be used via dispense or printing. This material helps minimize induced stresses, provides outstanding reliability performance and offers excellent mechanical resistance.

The YINCAE DA 150 series features solvent-free high temperature conductive or insulating die attach adhesives. This series offers excellent adhesion to both the substrate and bare die, can be used for small and large die attachments and can be used via dispense or printing. This material helps minimize induced stresses, provides outstanding reliability performance and offers excellent mechanical resistance.

The YINCAE TM series features solderable conductive adhesives which are fast curing, self-filling, self­ leveling and self-soldering. They can be used as die attach adhesive for a variety of applications including LED, CSP, QFP, etc ., and replace conductive adhesives (Ag) or other solder materials such as solder paste or preform. These materials can eliminate outgassing, die skewing and shifting and solder bleeding. TM series products contain a polymer which encapsulates the soldered interface and provides protection from harsh environmental conditions .

ProductProduct ApplicationCuring Temp. (°C)
DA 90Silver filled. conductive adhesive80 -110
DA 90BSilver filled, conductive adhesive80 -110
DA 90LSilica filled, insulating adhesive88 -110
DA 90LWInsulating adhesive for LED chip bonding80 -110
DA 150Silver filled, conductive adhesive150
DA 150AMixed powder, conductive adhesive150
DA 150LEInsulating adhesive for LED chip bonding150
DA 150LWSilica filled insulating adhesive150
DA 150UInsulating adhesive for GaN bonding150
TM 150Silver filled. solderable conductive adhesive180
TM 150E2Silver filled, solderable conductive adhesive165 -170
TM 230Silver filled. solderable conductive adhesive230

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