Frequently Asked Questions

Solder Joint Encapsulants

YINCAE solder joint encapsulant adhesives are epoxy based materials with a built-in flux function.

During reflow, solder joint encapsulant adhesives remove oxides allowing the solder joint to form, and encapsulate the solder joint in a 3D polymer network.

1. Enhance solder joint strength

2. Improve device reliability

3. Eliminate underfill and the underfilling process

4. Eliminate electrical issues (dendrites, electro-migration…)

5. Eliminates cleaning processes

6. Lower costs

1. 100 % reworkable – eliminate scrap cost

2. Air reflowable – eliminate nitrogen cost

3. Lower material usage

4. Short manufacturing process – See comparison below

5. High process yield

Eliminate shrinkage factor generated by underfill (gap is filled with air when using solder joint encapsulants) – Less stress improves reliability

Yes, solder joint encapsulant products provide additional mechanical strength to solder joints to help mitigate the impact of warpage.

Solder joint encapsulants encapsulate the solder joints after reflow to prevent dendrite formation.

BP 256 is a ball bumping adhesives designed to enhance solder joint strength during ball bumping processes

 

Advantages

1. Enhance solder bonding strength

2. Increase throughput

3. Eliminate additional cleaning steps

4. Eliminate underfilling process in SMT production

5. Reduce costs

brochure specifically for BP 256 with more detailed information and reliability data is located on our website.

Underfill Materials

YINCAE SMT 88 series underfills and SMT 158UL

YINCAE SMT 158 and SMT 158HA series capillary underfills

YINCAE WL 125 series wafer level underfills

1. Nano underfill

2. Fast cure option

3. No resin bleeding

4. Full compatibility with lead-free processes

5. Good for narrow gap underfilling

6. High reliability

1. Room temperature underfilling

2. Fast flow

3. Fast low temperature cure

4. High reliability

5. Friendly storage conditions

6. Easy rework

Yes, YINCAE offers three thermally conductive underfill materials

1. SMT 158A

2. SMT 158D – Diamond filled

3. SMT 158FB7

Yes, YINCAE offers a wide range of underfills including:

1. Board level capillary underfill

2. Package level capillary underfill

3. Non-flow underfill

4. Reflowable underfill

5. Thermal underfill

Yes, contact us with material requirements and we can send product information.

Yes, our SMT 158 and SMT 158HA series underfills are permanent

Yes, our SMT 88 series underfills and SMT 158UL, are reworkable

Yes, please contact us using one of the links provided below. We also have a brochure available on our website.

SMT 160 is a recently developed unfilled reflowable (no – flow) underfill.

Reflowable (no – flow) underfills, such as SMT 160, are underfill materials that do not flow away from areas where they are applied. This allows users to apply (print or dispense) the no – f low underfill material and place the component in a subsequent step. They are especially useful for applications which have a small footprint.

YINCAE reflowable (no – flow) underfill materials are designed to:

• Eliminate capillary underfills

• Simplify the assembly process

• Combine underfilling and soldering in the SMT processes

• Increase throughput

• Reduce costs

YINCAE offers three reflowable (no – flow) underfills

1. SMT 160 – unfilled, reflowable underfill, compatible with typical Pb – free reflow profiles

2. SMT 160L – unfilled, reflowable underfill, compatible with typical low temperature Pb – free reflow profiles

3. SMT 158R – filled, reflowable underfill, compatible with typical Pb – free reflow profiles

Unfilled underfills are designed for board – level applications as well as applications with no C.T.E. mismatch. They are also easy to rework.

Filled underfills are designed for package level and wafer level applications as well as applications with significant C.T.E. mismatch. Filled underfills are generally difficult to rework.

Die Attach Adhesives

YINCAE DA 90 series die attach adhesives

Many YINCAE DA 150 series die attach adhesives cure within 15 minutes.

Yes, the DA 90 and DA 150 series consist of both insulating and conductive die attach materials.

1. Low temperature cure option

2. Low temperature cure for high temperature applications (400°C)

3. Low induced stresses

4. Excellent mechanical resistance

5. High reliability

6. High temperature reflow

TM series products are highly conductive solderable adhesives and can replace conductive adhesives, such as silver paste, or solder materials.

1. Higher thermal conductivity compared to pure solder alloy

2. Lower process temperatures and high application temperatures

3. Eliminates outgassing issues

4. Eliminates cleaning processes

5. Self-filling and Self-leveling

6. Withstands harsh environments

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

We also have a brochure with additional information regarding our die attach materials available on our website.

Yes, please contact us using one of the links provided below. We also have a brochure available on our website.

Wafer Level

YINCAE WL 125 series wafer level underfills

YINCAE WL 66H is designed for wafer level die attach applications

Yes, YINCAE offers WL 66C, WL 66L, and WL 66O

Both, these products are generally cured using UV for fast fixing purposes and then thermally cured for high reliability.

1. High throughput and process yield

2. High reliability

3. Non – Yellowing

WTA 60 is a temporary bonding adhesive designed for thin wafer protection. WTA 60 prevents damage to wafers during standard semiconductor equipment processing. It is removed using YINCEA WTR 50.

WCP 45 is an aqueous polymer coating designed to protect wafers during laser dicing, drilling, and grooving procedures. It can easily be removed using D.I. water at room temperature.

ACP 120 is a Nano film designed as a low-cost alternative to gold coatings currently used on pins.

Yes, ACP 158 is an anisotropic conductive adhesive designed for wafer level applications.

WL 66 C / L / O all have different viscosities and are intended for the same purpose: wafer level lens and optical lens attachment materials. WL 66H is designed for wafer level die attach applications

We have many more options. The products shown on the tree are our most popular materials. Please contact us if you are looking for a material with specific properties.

Optoelectronic Materials

Yes, YINCAE LEN 66A / 66AL are colorless, fast, UV curable bonding adhesives for lens bonding applications.

YINCAE UVA 88A Series products are dual cure UV adhesives designed for optical device bonding applications.

 

YINCAE UVA 88E Series products are dual cure UV encapsulants designed for optical device bonding applications.

OF 66B/C are dual cure (Heat + UV) optical, fiber optic, and optoelectronic devices.

YINCAE LCD 66F is a UV curable LCD end sealant offering low moisture absorption.

YINCAE LCD 66L is a UV curable, bio-compatible, optical bonding adhesive designed for LCD screen bonding applications.

1. Low thermal stress

2. High throughput

3. High process yield

4. High reliability

5. Excellent moisture resistance

6. Withstands harsh environmental conditions

1. Low temperature cure

2. High process yield

3. High reliability

4. Excellent moisture and solvent resistance

We have many more options. The products shown on the tree are our most popular materials, Please contact us if you are looking for a material specific properties.

Conformal Coating Materials

UVC 88F – designed for flexible substrates

UVC 88P – designed for rigid substrates

UVC 88G – biocompatible flexible hydrogel coating

UVC 88B – biocompatible flexible polymer coating

EMC 25 and 25A are designed for protect surfaces from electromagnetic interference and improve surface conductivity.

NCF 25 is an anti-oxidation solderable coating designed to prevent corrosion and rust on metal surfaces, including nickel, steel, aluminum…, and solderable surfaces.

BF 90S and BF 150S are lid sealants designed to protect surfaces, such as: PCB, copper, ceramic, glass, or aluminum, from moisture, dust, chemicals and other harsh environmental conditions. BF 90S cures at 90°C while BF 150S cures at 150°C.

Sales Representatives

Please contact us with your location and we can pair you with the nearest sales representative to offer support.

Yes. Please contact us and we can help arrange a meeting.

Shipping

Yes, we ship internationally at the end of each week.

We package the materials in thermal coolers with dry ice to help safeguard a below freezing temperature. We try to ship using next day delivery services to all domestic locations.

We try to ship using the fasted method on all international and domestic shipments.

See FedEx list of countries where Dangerous Goods services are available.

You are provided with a tracking number to track your shipment for any customs delays. If you were not provided with a tracking number, please contact us to receive one.

Please have the receiver ready to pay duties and taxes on a shipment if your country requires. YINCAE is not responsible for any duties or taxes accrued during a shipment.

Please contact us to discuss.

© 2021 YINCAE Advanced Materials, LLC – All Rights Reserved