► Stand-off Height of Solder Joints

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

► Pull Strength of Solder Joints

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

► Weibull Plot of Thermal Cycling Failure Using Solder Joint Encapsulant

Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle

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