YINCAE
PRODUCTS
YINCAE Advanced Materials, LLC offers a wide variety of high performance coatings, adhesives and electronic materials. We have highlighted some of our most popular products. A majority of our products can be tailored to meet our client’s needs. For more information about specific products or for access to product data sheets, please feel free to contact us at info@yincae.com.
Technical Information
ABOUT US
YINCAE is a U.S. company founded in 2005. Our corporate headquarters and manufacturing operations are located in Albany, New York. The YINCAE brand is a name recognized worldwide as an industry leader in the development of advanced micro-electronic grade materials used in the computer microchip and optoelectronics industries.
News & Events
YINCAE Launches Snap Cure, Highly Filled, 100% No-Clean Flux Residue Compatible Underfill: UF 120HA
YINCAE Launches Breakthrough Thermal Underfill: UF 158A2
YINCAE Releases YINCAE Won Global Technology Award 2022
YINCAE Releases High Performance Fully Flux Residue Compatible Underfill UF 158HA
YINCAE Releases DA 158N Die Attach Adhesive Withstanding -273ºC
YINCAE Releases New SMT 158N Series Withstanding -273ºC
YINCAE Releases World’s First Commercially Diamond Underfill
The benefits UF 120HA can provide are:
Fully compatible with all no-clean solder paste flux residue
Eliminating the cleaning process and its pollution
Lower temperature snap cure ( <120ºC)
Passes 5×260 ºC reflow without any deformation of the solder joint
Better than all competitors’ underfill with a cleaning process
Lower CTE and able to flow into small gaps
Reworkable
Large cost savings
Corporate Policy
- Provide quality product to meet or exceed customer needs, expectations and requirements
- Build an organization culture to focus on continual improvement and innovation
- Make products to comply with relevant laws and regulations
- Ensure reliable risk management using best preventive practices
- Feedback external and internal customers’ input
- Identify and provide necessary resources