Press Release

Albany, NY– YINCAE, a leading manufacturer of electronic materials, has announced the launch of its new product, UF 120HA. The innovative underfill material is specifically designed to provide a fast flow, lower-temperature cure for high-throughput applications and is 100% compatible with all no-clean flux residue. Additionally, it is reworkable, making it an ideal solution for manufacturers looking to reduce costs and improve production efficiency.

UF 120HA offers several key benefits:

  • Fully compatible with all no-clean solder paste flux residue
  • Eliminating the cleaning process and its pollution
  • Lower temperature snap cure (<120 ºC)
  • Passes 5×260 ºC reflow without any deformation of the solder joint
  • Better than all competitors’ underfill with a cleaning process
  • Lower CTE and able to flow into small gaps
  • Reworkable
  • Large cost savings

“Our team is excited to introduce UF 120HA to the market,” said YINCAE’s Chief Technology Officer. “We understand the challenges facing manufacturers today, and we have designed this product to address those challenges head-on. UF 120HA offers fast flow, low-temperature cure, compatibility with all no-clean flux residue, and reworkability, making it an ideal solution for a wide range of high-throughput manufacturing applications.”

YINCAE’s UF 120HA is available immediately for purchase. For more information on YINCAE’s UF 120HA underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product: Thermal Underfill – UF 158A2.

       Designed for use in a variety of electronic devices, not only can UF 158A2 replace underfill, silver epoxy paste and thermal pad/paste in one step in CoWoS package, but also provides superior protection and improved thermal management for critical components. By filling the space between the device and the PCB (Printed Circuit Board), Thermal Underfill enhances the structural integrity of the assembly while reducing stress on solder joints.

      UF 158A2 is ideal for use in high-reliability applications where temperature cycling, shock, and vibration can cause damage to electronic components. The product features excellent thermal conductivity and high-temperature stability, ensuring optimal performance even in the most demanding environments.

  “We are excited to introduce UF 158A2 to our product portfolio,” said Dr. Wusheng Yin, CEO of YINCAE. “Our team of engineers and scientists have worked tirelessly to develop a product that meets the growing demands of the electronics industry. We believe that UF 158A2 will provide our customers with a reliable and cost-effective solution: 1). Fast flow and easy to underfill 100×100 mm chip (20m gap); 2) Shorten Manufacturing Process; 3). High thermal conductivity 3-4W/mk; 4). Snap cure and reworkable; 5). Huge cost saving, for their thermal management needs.”

      UF 158A2 is available in a variety of formulations to suit different application requirements. The product is easy to apply and can be cured at low temperatures, making it suitable for use with a range of electronic devices. With its exceptional performance, reliability, and ease of use, UF 158A2 is set to become a key player in the electronics industry.                                

For more information on YINCAE’s UF 158A2 underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

YINCAE Advanced Materials Won Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

 (Albany, NY) November 08, 2022YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category! This ceremony took place on Wednesday, November 2nd at  SMTAI 2022 Exhibition in Minneapolis, USA.

YINCAE’s die attach material was recognized as one of the products that made the greatest impact on the electronics industry in the years 2021 and 2022. Due to its unique properties, YINCAE die attach adhesive has a high thermal conductivity and can achieve very thin bonding line thickness- there is no any bleeding and migration issue. It  has excellent bonding strength, a thermal cycling performance, and can withstand extreme temperatures ( -273°C) without any delamination.

About Global Technology Awards

The Global Technology Awards are universally recognized as the most international industry award, attracting entries from Europe, USA and Asia. Each year the Global Technology Awards recognize the latest innovations in production equipment and materials for the EMS industry by a distinguished panel of industry experts.

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Founded in 2005, and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronics materials used in electronic and optoelectronic devices. YINCAE products provide innovative solutions to support manufacturing processes from wafer level, to package level, to board level, and in final devices.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) August 15, 2022 YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill.  Using UF 158HA can eliminate cleaning process and pollution from the cleaning process, and simplify the manufacturing process.

Due to its unique properties, UF 158HA is not only a high performance underfill but also can function as solder mask with eliminating electric migration. The benefits of using UF 158HA are:

  • Fully compatible with all no-clean solder paste flux reside
  • Eliminating cleaning process and its pollution
  • Large cost saving
  • Pass 5×260 ºC without any deformation of solder joint
  • Better than all competitors’ underfill with cleaning process
  • Be able to flow into 20m gap
  • Withstand high temperature up to 400 ºC.

This material can be used for BGA, flip chip, wafer-level chip scale package application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed, mechanical shock and reliability are key concerns.

For more information on YINCAE’s UF 158HA underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) March 30, 2022 YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA158N is preparing the materials for people to live in the Mars.

Due to its unique properties, DA158N die attach adhesive has a high thermal conductivity and can achieve very thin bonding line thickness, there is no any bleeding and migration issue. Furthermore, the DA 158N has excellent bonding strength, and a thermal cycling performance that is significantly greater than that of the leading competitors’. The DA 158N can withstand extreme temperatures ( -273°C) without any delamination, and still outperform current competitor products on the market. This not only has extraordinary implications for the use of DA 158N but also indicates the broad range of uses it potentially has across current industries.

This material can be used for all die attach application, particularly for harsh condition application. While it is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

 It is designed for high production and friendly environment where process speed and reliability are the key concerns. This material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance (e.g. temperature cycling performance), and excellent mechanical resistance.

For more information on YINCAE’s DA158N die attach materials, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) December 20, 2021 YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.  

The compatibility of underfill and flux residue has long been a traditional issue in the electronic industry. This compatibility issue normally leads to underfill flow issue, underfill voids, underfill delamination and solder extrusion during the double reflow process and automotive application. Typically, it is too costly to clean the flux residue in SMT assembly. SMT 88UL2 is designed to be fully compatible with the flux residues of almost all solder paste from major manufacturers. SMT 88UL2 can fast flow into any gap size (less than 1m) at room temperature and fast cure at lower temperatures without any flow and void issues eliminating cleaning flux residue. Our SMT 88UL2 can withstand multiple 260°C reflow process without any delamination, solder extrusion and solder ball issues without cleaning flux residue. It has demonstrated excellent drop and thermal cycling performance.

This material can be used as an underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and an environment where process speed and thermal dissipation are key concerns.

For more information on YINCAE’s SMT 88UL2 underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) February 11, 2021 YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

Due to its unique properties, SMT 158N series has a high viscosity and can be used as a dam material, corner bond, edge bond or as an encapsulant. Furthermore, the SMT 158N has lap shear and pull strength, and a thermal cycling performance that is significantly greater than that of the leading competitors’ underfills. The SMT 158N can withstand extreme temperatures ( -273°C), and still outperform current competitor products on the market. This not only has extraordinary implications for the use of SMT 158N but indicates the broad range of uses it potentially has across current industries.

This material can be used for flip chip, wafer-level chip scale package application. While also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

It is designed for high production and an environment where process speed and reliability are the key concerns. This material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance (e.g. temperature cycling performance), and excellent mechanical resistance.

For more information on YINCAE’s SMT 158N series underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

Albany, NY) January 18, 2021 YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast flowing, and an easy reworkable liquid epoxy.

SMT 158D8 is the world’s first (and only) commercially available diamond filled underfill. SMT 158D8 has a thermal conductivity of >6 W/mK, can flow into small gaps easily with no phase separation, high salt-moisture resistance, and excellent adhesion. Furthermore, the performance of the SMT 158D8 drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The highlight of the SMT 158D8 is its ability to lower CPU (POP) temperatures by 10 °C.

This material can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and an environment where process speed and thermal dissipation are key concerns.

For more information on YINCAE’s SMT 158D8 underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) August 19, 2019 – YINCAE is excited to announce that we have successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering
wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package),  particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill. To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing. Using NC 256 and SMT 158HA together can eliminate cleaning completely. NC 256 can be used for mass reflow process or rework process.

Additional information on the NC 256 is available by contacting YINCAE at
info@yincae.com.

Press Release

(Albany, NY) August 19, 2019 – YINCAE is excited to announce that we have successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering
wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package),  particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill. To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing. Using NC 256 and SMT 158HA together can eliminate cleaning completely. NC 256 can be used for mass reflow process or rework process.

Additional information on the NC 256 is available by contacting YINCAE at
info@yincae.com.

Press Release

(Albany, NY) July 16, 2019 We’re proud to announce that YINCAE has received its official ISO 9001:2015 certification! This certification is a testament of YINCAE’s commitment to customer satisfaction, quality, and continuous improvement.

ISO 9001 is a quality management system standard that was developed by the International Organization for Standardization, an association of governmental and nongovernmental organizations from many
countries. The ISO 9001 standard is utilized to certify quality management systems that focus on continuous improvement, customer satisfaction and the active involvement of both management and employees in a process based approach.

“I could not be happier with the performance everyone at YINCAE has shown throughout the ISO 9001:2015 certification process,” said Dr. Wusheng Yin, CEO of YINCAE. “This certification has
demonstrated our clear desire to always operate at the highest levels of quality and efficiency. This is not just recognition of our tireless efforts to put the best products and service available on the market but that we intend to do so in the future!”

YINCAE anticipates that the ISO 9001:2015 certification will help the company:
• Provide quality products to meet or exceed customer’s needs, expectations and requirements
• Build an organization culture to focus on continual improvement and innovation
• Produce products that comply with relevant laws and regulations
• Ensure reliable risk management using best preventive practices
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the
microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 – 2, 2019.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics. YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications. YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications. YINCAE underfills not only offer high thermal conductivity and high Tg ( 245°C) but also can be used at over 400 °C. To schedule a meeting with the YINCAE team during the Symposium, please email us at: yincae_cs@yincae.com with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: www.yincae.com We are looking forward to seeing you at this symposium!

We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have. For more information or if you have any questions, please feel free to visit our website at: www.yincae.com or give us a call at 518-452-2880. We look forward to seeing you there.

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Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

Press Release

(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill. Please find a summary below:

One of the most essential and difficult aspects of wafer level integration is the requirement for zero outgassing during the underfill curing process. This step is crucial as outgassing can contaminate neighboring components. Additionally, cleaning flux residue is also becoming more difficult as electrical components across all industries are increasing in density and miniaturization. In particular, the automotive industry is growing rapidly in its need for underfills as they can be used to enhance mechanic strength and to absorb stress from CTE mismatch 

In response to this growing need, YINCAE has successfully developed a zero outgassing, flux residue-compatible underfill, the SMT 158HA. This underfill does not require the cleaning of flux
residue and has repeatedly demonstrated zero outgassing during the curing process. After curing, the electronic device can pass a 5x 260°C reflow process.

Press Release

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