Press Release

(Albany, NY) February 11, 2021 YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

Due to its unique properties, SMT 158N series has a high viscosity and can be used as a dam material, corner bond, edge bond or as an encapsulant. Furthermore, the SMT 158N has lap shear and pull strength, and a thermal cycling performance that is significantly greater than that of the leading competitors’ underfills. The SMT 158N can withstand extreme temperatures ( -273°C), and still outperform current competitor products on the market. This not only has extraordinary implications for the use of SMT 158N but indicates the broad range of uses it potentially has across current industries.

This material can be used for flip chip, wafer-level chip scale package application. While also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

It is designed for high production and an environment where process speed and reliability are the key concerns. This material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance (e.g. temperature cycling performance), and excellent mechanical resistance.

For more information on YINCAE’s SMT 158N series underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

Albany, NY) January 18, 2021 YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast flowing, and an easy reworkable liquid epoxy.

SMT 158D8 is the world’s first (and only) commercially available diamond filled underfill. SMT 158D8 has a thermal conductivity of >6 W/mK, can flow into small gaps easily with no phase separation, high salt-moisture resistance, and excellent adhesion. Furthermore, the performance of the SMT 158D8 drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The highlight of the SMT 158D8 is its ability to lower CPU (POP) temperatures by 10 °C.

This material can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and an environment where process speed and thermal dissipation are key concerns.

For more information on YINCAE’s SMT 158D8 underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) August 19, 2019 – YINCAE is excited to announce that we have successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering
wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package),  particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill. To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing. Using NC 256 and SMT 158HA together can eliminate cleaning completely. NC 256 can be used for mass reflow process or rework process.

Additional information on the NC 256 is available by contacting YINCAE at
info@yincae.com.

Press Release

(Albany, NY) August 19, 2019 – YINCAE is excited to announce that we have successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering
wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package),  particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process. During reflow there is no contamination on solder ball or the neighboring component. NC 256 can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components.

Using NC 256 can eliminate the cleaning process and is fully compatible with underfill. To avoid the contamination from underfill, YINCAE SMT 158HA is recommended with NC 256 together because SMT 158HA has zero outgassing. Using NC 256 and SMT 158HA together can eliminate cleaning completely. NC 256 can be used for mass reflow process or rework process.

Additional information on the NC 256 is available by contacting YINCAE at
info@yincae.com.

Press Release

(Albany, NY) July 16, 2019 We’re proud to announce that YINCAE has received its official ISO 9001:2015 certification! This certification is a testament of YINCAE’s commitment to customer satisfaction, quality, and continuous improvement.

ISO 9001 is a quality management system standard that was developed by the International Organization for Standardization, an association of governmental and nongovernmental organizations from many
countries. The ISO 9001 standard is utilized to certify quality management systems that focus on continuous improvement, customer satisfaction and the active involvement of both management and employees in a process based approach.

“I could not be happier with the performance everyone at YINCAE has shown throughout the ISO 9001:2015 certification process,” said Dr. Wusheng Yin, CEO of YINCAE. “This certification has
demonstrated our clear desire to always operate at the highest levels of quality and efficiency. This is not just recognition of our tireless efforts to put the best products and service available on the market but that we intend to do so in the future!”

YINCAE anticipates that the ISO 9001:2015 certification will help the company:
• Provide quality products to meet or exceed customer’s needs, expectations and requirements
• Build an organization culture to focus on continual improvement and innovation
• Produce products that comply with relevant laws and regulations
• Ensure reliable risk management using best preventive practices
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the
microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Press Release

(Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 – 2, 2019.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

YINCAE offers a variety of exclusive materials such as thermal interface and wafer-level /packaging level/board level materials, die attach adhesives and underfill that have been adopted by leading contract manufacturers and tier 1 microelectronic customers, and we are excited to be showcasing some or our most popular products at iMAPS 52nd International Symposium on Microelectronics. YINCAE innovated the world’s first lead-free solder joint encapsulation adhesive solution for wafer level, flip chip, POP, LGA, BGA and many other applications. YINCAE offers SJEA for low, medium and high temperature solder alloy applications for your unique applications. YINCAE underfills not only offer high thermal conductivity and high Tg ( 245°C) but also can be used at over 400 °C. To schedule a meeting with the YINCAE team during the Symposium, please email us at: yincae_cs@yincae.com with a brief description of the meeting topic. You can also find more information about our products by visiting our website at: www.yincae.com We are looking forward to seeing you at this symposium!

We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have. For more information or if you have any questions, please feel free to visit our website at: www.yincae.com or give us a call at 518-452-2880. We look forward to seeing you there.

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Founded and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials used in microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

Press Release

(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill. Please find a summary below:

One of the most essential and difficult aspects of wafer level integration is the requirement for zero outgassing during the underfill curing process. This step is crucial as outgassing can contaminate neighboring components. Additionally, cleaning flux residue is also becoming more difficult as electrical components across all industries are increasing in density and miniaturization. In particular, the automotive industry is growing rapidly in its need for underfills as they can be used to enhance mechanic strength and to absorb stress from CTE mismatch 

In response to this growing need, YINCAE has successfully developed a zero outgassing, flux residue-compatible underfill, the SMT 158HA. This underfill does not require the cleaning of flux
residue and has repeatedly demonstrated zero outgassing during the curing process. After curing, the electronic device can pass a 5x 260°C reflow process.

Press Release

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