Board level assembly

The YINCAE® SMT 256/SMT 266 Product Series is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications . They remove metal oxide and allow individual solder joints to be formed, encapulated by 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Several products are available in the series, each is formulated to meet specific product design parameters. The SMT 256 products are designed for dip or print applications, whereas the SMT 266 products are designed for automated jetting applications during assembly (and can also be brushed on during rework) . A Dip Paste product with similar performance properties is also available. All products in this series provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.

ProductProduct ApplicationReflow Peak Temp. (°C)
SMT 256High-temperature applications e.g. Pb free230-260
SMT 256BCHigh-temperature applications e.g. Pb free (Black)230-260
SMT 256CHigh-temperature applications e.g. Pb free (Clear)230-260
NC 256High-temperature applications -Zero flux residue230-260
SMT 256EPT5/T6High-temperature solder paste230-260
SMT 256EDT5/T6High-temperature solder paste  – dispensable230-260
SMT 266High-temperature applications e.g. Pb free230-260
BP 256Ball attachment220-260
SMT 138Low temperature application140- 185
SMT 138PLow temperature solder paste replacement -Printing140-185
SMT 138ELow temperature solder paste replacement – Dispense140-185

© 2021 YINCAE Advanced Materials, LLC – All Rights Reserved