thermal interface materials

Our TM solderable conductive adhesive products are rapid cure, self-filling, self-leveling and self­ soldering adhesives, which can be used as die attach adhesives for LED, CSP, QFP etc., to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to conductive adhesives (Ag),TM products have higher electrical and thermal conductivity. In comparison to soldering materials, our solderable adhesives eliminate outgassing from soldering processes, eliminate die skewing and shifting and eliminate solder bleeding. This soldered interface is encapsulated with a 3D polymer network after curing allowing it to tolerate harsh environmental conditions .

Our TGP reactive thermal grease products form a very thin BLT eliminating micro bubbles at the rough interface when applied. In service time. the products cure to form a thermal gel or thermal pad with the performance of a thermal phase change material.

Our TCA products cure at low temperatures and offer excellent adhesion strength to copper, aluminum, steel, glass, ceramics and most plastics.

Our TEC products are thermally conductive and anisotropically electrically conductive. During the curing process, this material can obtain a conductivity that is equal in magnitude to that of the metal surface.

ProductProduct ApplicationCuring Conditions
SMT 138ELow temperature solder paste replacement -dispense140-185°C
SMT 256EPHigh temperature solder paste replacement230 -260°C
SMT 256EPDT6High temperature solder paste replacement -dispense230 -260°C
TGP 100Reactive thermal grease150°C
TGP 110 -2Reactive thermal greaseCures over time, no additional step
TGP 110A2Reactive thermal adhesive150°C
TGP 88AReactive thermal adhesive88°C
TM 150Solderable conductive adhesive180°C
TM 150ESolderable conductive adhesive150°C
TM 150E2Solderable conductive adhesive165 -170°C
TM 158Diamond filled thermal conductive adhesive150°C
TM 230Solderable conductive adhesive230°C

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