WAFER LEVEL MATERIALS

YINCAE’s ACP 120 series is an excellent option for customers looking for an anti- oxidation coating for solderable and metal surfaces such as zinc, nickel, steel, aluminum and more. Features include excellent anti-oxidation performance and adhesion, excellent anti-corrosion and anti-rusting, high thermal resistance, room temperature drying and easy rework when wet. Some highlights are:
Eliminates Gold Plating Process
Low Cost Ownership
Environmentally Friendly
High Throughput
Reworkable Process
Large Process Window
ACP 120 can be customized to meet customer requirements.
Our WL 66 series are UV curable optical lid attachment adhesives designed for wafer level lens and optical lens attachment. They provide a bubble free optical coverage, high moisture resistance and high temperature resistance. The product also remains transparent and does not yellow.
Product | Product Application | Curing Conditions |
ACP 120 | Nanofilm -gold replacement | RT |
ACP 158H | Anisotropic conductive adhesive | 150°C |
ACP 158L | Anisotropic conductive adhesive | 150°C |
SMT 256T | Transparent solder joint encapsulant | 230 -260°C |
WCP 45 | Wafer protection coating | RT |
WL 66C | Wafer level optical lens attachment adhesive | UV |
WL 66H | Wafer level die attach adhesive | 100°c |
WL 66L | Wafer level optical lens attachment adhesive | UV |
WL 660 | Wafer level optical lens attachment adhesive | UV |
WL 125 | Wafer level underfill | Thermal/TCB |
WL 125F | Wafer level underfill | Thermal/TCB |
WTA 60 | Temporary bonding adhesive | RT |