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Groundbreaking Underfill


(Albany, NY) January 13, 2016 – YINCAE Advanced Materials, LLC is pleased to announced the availability of the SMT 88 UL. SMT 88 UL is a novel and groundbreaking underfill.


 Advantages of the SMT 88 UL include unnecessary heating, room temperature underfill, high reliability, and compatibility with flux residues. Without heating, it can be underfilled into 10µ gap at room temperature, where normal underfill cannot flow into microgap. Furthermore, traditional underfills are sprayed and can cause contamination problem. SMT 88 UL can successfully remove these problems and flow into microgap easily.


 SMT 88 UL is a very ubiquitous underfill. It can be used anywhere – wafer-level (CSP), package-level, and board-level (LGA, BGA, and QFN) to name a few.


 Additional information on the SMT 88 UL is available by contacting YINCAE at


If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.


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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.


The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.



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