BREAKING NEWS! YINCAE receives ISO 9001:2015 Certification

YINCAE Releases World's First Commerically Available Diamond Filled underfill ( Jan. 18/21)

YINCAE Releases A New Underfill Withstanding -273 Degree Celsius (Feb. 11/21)!

 

Die Attach Adhesive
The YINCAE DA 90 series features solvent-free low temperature conductive or insulating die attach adhesives. This series offers excellent adhesion to both the substrate and bare die, can be used for small and large die attachments, and can be used via dispense or printing. This material helps minimize induced stresses, provides outstanding reliability performance, and offers excellent mechanical resistance. The YINCAE DA 150 series features solvent-free high temperature conductive or insulating die attach adhesives. This series offers excellent adhesion to both the substrate and bare die, can be used for small and large die attachments, and can be used via dispense or printing. This material helps minimize induced stresses, provides outstanding reliability performance, and offers excellent mechanical resistance. The YINCAE TM series features solderable conductive adhesives which are fast curing, self-filling, self-leveling, and self-soldering. They can be used as die attach adhesive for a variety of applications including LED, CSP, QFP, etc., and replace conductive adhesives (Ag) or other solder materials such as solder paste or preform. These materials can eliminate outgassing, die skewing and shifting, and solder bleeding. TM series products contain a polymer which encapsulates the soldered interface and provides protection from harsh environmental conditions. Product Application Notes
Data Sheets for YINCAE products available upon request

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