For Tin/Lead and Lead Free Ball Attachment
Wide Process Window
Eliminates Underfill Materials and Process
Enhances Solder Strength 5-10x
Low Cost Ownership
► Stand-off Height of Solder Joints
► Pull Strength of Solder Joints
► Weibull Plot of Thermal Cycling Failure Using Solder Joint Encapsulant
Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.
Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.
Thermal Cycling Conditions: SAC305; I/O 1156; -55°C~150°C; 1h/cycle.