08/25/2025 (Albany, NY) — YINCAE, a global leader in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 – October 1. Visitors will experience next-generation solutions designed to meet the reliability, thermal, and processing challenges of today’s most demanding electronic applications.

Highlights at the IMAPS:

• High-Performance Underfill (UF 120HA2):
  • 100% compatible with no-clean flux residue
  • Passes 10×260°C reflow without cleaning
  • Low CTE for superior reliability
  • Fast flow and rapid cure for efficient assembly
• Advanced Die Attach Materials (TM 230-2):
  • Low-void, high-reliability solutions
  • Low-temperature process compatibility
  • Options for both soldering and sintering for large-die applications
• Next-Generation Liquid Metal Solutions (TM 150LM):
  • High viscosity and superior reliability
  • No blow-out or pump-out, even under thermal cycling
  • Exceptional heat dissipation for TIM1, TIM1.5, and TIM2 applications

“Our portfolio demonstrates a unique combination of thermal performance, reliability, and process efficiency,” said Dr. Wusheng Yin, CEO at YINCAE. “We’re excited to showcase materials that enable the future of advanced packaging and high-power devices.”

Attendees can visit Booth # 817 at IMAPS to learn more about these high-performance materials and see live demonstrations.

For more information on YINCAE’s IMAPS tradeshow, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

(Albany, NY) August 5, 2025 — YINCAE, a leader in electronic material solutions, today announced the launch of its next-generation Liquid Metal Thermal Interface Material (TIM), engineered with enhanced viscosity properties to deliver exceptional performance, processability, and long-term reliability.

Unlike conventional liquid metal TIMs, which can be difficult to handle and prone to instability at elevated temperatures, YINCAE’s new formulation offers higher viscosity at room temperature, enabling precise, easy, and consistent stencil or syringe printing for streamlined assembly processes.

Critically, the material also maintains higher viscosity at elevated operating temperatures, reducing pump-out, flow, or bleed issues often seen in traditional formulations. This unique thermal stability translates into improved interface integrity and reliability under harsh thermal cycling and continuous high-temperature environments.

“We developed this advanced liquid metal TIM to address both the application challenges and long-term performance demands of today’s high-power electronics,” said Dr. Wusheng Yin, CEO at YINCAE. “The improved viscosity profile allows for cleaner, more controlled printing, while maintaining form stability under thermal stress—two key factors for manufacturers seeking high-performance, reliable thermal solutions.”

Key Features:

• High viscosity at room temperature for improved printability and handling
• Maintains high viscosity at elevated temperatures for enhanced reliability
• Excellent thermal conductivity ideal for high-power CPUs, GPUs, and power modules
• Compatible with automated dispensing and stencil printing

This innovation represents a significant advancement in the field of liquid metal TIMs, where thermal performance often comes at the expense of ease of use and mechanical reliability. YINCAE’s new material bridges that gap, offering manufacturers a practical and scalable solution for next-generation thermal management.

For more information on YINCAE’s  TM 150LM, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

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 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

03/11/2025 (Albany, NY) – YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

UF 158UL boasts exceptional flowability, allowing it to effortlessly fill gaps as small as 10 microns, even in large 100×100 mm chips. Its unique formulation ensures rapid curing at room temperature, significantly reducing production time and energy costs. Moreover, UF 158UL exhibits superior reliability, providing robust protection against thermal stress, moisture, and mechanical shock, ensuring long-term device performance.

“We are thrilled to introduce UF 158UL, a game-changer in underfill technology,” said CTO of YINCAE, “With its exceptional flow, fast cure, and high reliability, UF 158UL empowers manufacturers to achieve unprecedented levels of efficiency and quality in the production of large format chips.”

UF 158UL is ideal for a wide range of applications, including:

• High-performance computing
• Artificial intelligence
• Automotive electronics
• Aerospace systems

Key Features and Benefits:

• Room temperature flow for easy application
• Fast cure for increased throughput
• High reliability for long-term performance
• Excellent gap fill in 10-micron spaces
• Compatible with large 100×100 mm chips

YINCAE’s UF 158UL is available immediately for purchase. For more information on YINCAE’s UF 158UL underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

02/03/2025 (Albany, NY) – YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

UF 120LA withstands 5×260°C reflow cycles without solder joint deformation, outperforming competitors requiring cleaning. Its snap cure at lower temperatures enhances production efficiency, making it ideal for memory cards, chip carriers, and hybrid circuits.

UF 120LA’s superior thermal resistance and mechanical durability empower manufacturers to develop more compact, reliable, and high-performance devices, accelerating trends in miniaturization, edge computing, and IoT connectivity. This advancement can enhance the production of mission-critical applications such as 5G and 6G infrastructure, autonomous vehicles, aerospace systems, and wearable technology, where reliability and longevity are paramount. Additionally, by streamlining manufacturing workflows, UF 120LA enables faster time-to-market for consumer electronics, potentially reshaping supply chain efficiencies and creating new opportunities for economies of scale.

In the long term, the widespread adoption of this technology could revolutionize the semiconductor packaging landscape, paving the way for increasingly sophisticated electronic devices that are lighter, more efficient, and more resilient in extreme environments.

Key Benefits:

• No-clean compatibility – Works with all no-clean solder paste flux residues.
• Cost savings – Eliminates cleaning processes and pollution.
• High thermal reliability – Withstands multiple reflow cycles without deformation.
• Superior flowability – Fills narrow gaps as small as 20μ.
• Less warpage – low CTE and high thermal stability.

“The UF 120LA represents a significant leap forward in electronics packaging technology,” said YINCAE’s Chief Technology Officer. “UF 120LA empowers manufacturers to push the boundaries of advanced packaging applications, from BGA to wafer-level chip scale packages. We believe this product will set a new industry standard for performance and efficiency.”

YINCAE’s UF 120LA is available immediately for purchase. For more information on YINCAE’s UF 120LA underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website: www.yincae.com

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.