BREAKING NEWS: YINCAE Wins Global Technology Award

SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

 

WHITE PAPERS

Underfill for Ultra-Low Bumped (10µ) 3D Package (WP-1012-02/2016)

A High Thermal Conductive Solderable Adhesive (WP-1011-01/2016)

A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill (WP-1010-01/2016)

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement (WP-1009-01/2016)

The Future of Solder Joint Encapsulant (WP-1008-10/2015)

A Lower Temperature Solder Joint Encapsulant For Sn/Bi Applications (WP-1007-11/2014)

Solderable Anisotropic Conductive Adhesives For 3D Package Applications (WP-1006-09/2014)

An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates (WP-1005-07/2014)

Solder joint encapsulant adhesive - LGA high reliability and low cost assembly solution (WP-1004-04/2014)

Solder joint encapsulant adhesive POP assembly solution (WP-1003-03/2014)

Solder joint encapsulant adhesive POP TMV high reliability and low cost assembly solution (WP-1002-03/2014)

A novel low temperature fast flow and fast cure reworkable underfill (WP-1001-01/2014)

A novel high thermal conductive underfill for flip chip application (WP-1000-03/2013)

 

Presentations

 

"The Future of Solder Joint Encapsulant Adhesives," October 29th, IMAPS 2015

"A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications," September 29th, SMTAI 2015

"An Overview of Advanced Materials," May 27th, ECTC 2015

"The Future of Solder Joint Encapsulant Adhesives," February 23rd, IPC APEX EXPO 2015

"The Future of Solder Joint Encapsulation," March 20th, IMAPS New England Expo 2015

"The Future of Solder Joint Encapsulation," October 24th, IPC Tech Summit 2014

"Solderable Anisotropic Conductive Adhesives for 3D Package Applications," October 21st, International Symposium on Microelectronics 2014

"An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates," October 9th, SMTAI 2014

"A High Thermal Conductive Solderable Adhesive," April 30th, IMAPS Workshop at CNSE, 2014

"Solder Joint Encapsulate - Miniturization Solution," March 25-27th, APEX 2014

"A Novel High Thermal Conductive Underfill for Flip Chip Application" and "Solder Joint Encapsulant Adhesive - LGA High Reliability and Low Cost Assembly Solutions," October 1st-3rd, IMAPS 2013

"A Novel Underfill for 3D TSV Package" and "Solder Joint Encapsulate Adhesive - PoP TMV High Reliability and Low Cost Assembly Solution," April 30th-May 1st, IMAPS workshop 2013

"Solder Joint Encapsulant Adhesive - PoP Assembly Solution," August 29th, NEPCON 2012

"Gold Replacement - Nanofilm for Oxidatino Barrier," June 14th, IMAPS workshop 2012

"Innovative Rework Solution to Assembled IC Components," October 12-20th, SMTA 2011

"A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive" and "A Low Cost and High Thermal Conductive Solderable Adhesive," October 9-13th, IMAPS 2011

"A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill," July 13th, SEMICON West 2011

"A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive" and "A Low Cost and High Thermal Conductive Solderable Adhesive," May 3rd, IMAPS 2011

"Underfill for Ultra-Low Bumped (10u) 3D TSV Package" and "A First Individual Solder Joint Encapsulant Adhesives," November 3rd-4th, IMAPS 2010

"World First Solder Joint Encapsulant Adhesives," August 31st, NEPCON 2010

"A First Individual Solder Joint Encapsulant Adhesives," July 14th, SEMICON West 2010

Technical Poster

► "A First Individual Solder Joint Encapsulant Adhesives," IMAPS 2010

 

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