BREAKING NEWS: YINCAE Wins Global Technology Award

1. SEMICON WEST 2017, July 11-13. San Francisco, CA. BOOTH 5248 (NORTH HALL)

2. SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

3. IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

 

 

Board Level Assembly

 

 

Data Sheets for YINCAE products available upon request.

The YINCAE®  SMT256/SMT266 Product Series is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications.  They remove metal oxide and allow individual solder joints to be formed, encapulated by 3-D polymer network.   The resulting solder joint bond is  5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

 

Several products are available in the series, each is formulated to meet specific product design parameters. The SMT256 products are designed for dip or print applications, whereas the SMT266 products are designed for automated jetting applications during assembly (and can also be brushed on during rework).  A Dip Paste product with similar performance properties is also available.  All products in this series provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.

Products Application Note

 

 

 

SEMICON West 2017

July 11-13th

Moscone Center / BOOTH 5248 north hall

San Francisco, CA

 

SMTA International 2017

September 19-20th

Donald Stephens

Convention Center / BOOTH 329

Rosemont, IL

 

iMAPS 2017

October 10-12th

Symposium Microelectronics

BOOTH 416

Raleigh, NC

 

 

 

Open The Door For:

 

 

Innovative leaders

• 25+ years’ experience

• Worldwide support

• Award winning company

• Premier products

 

 

 

 

 

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