BREAKING NEWS: YINCAE Wins Global Technology Award

SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

 

 

Underfill Materials

 

 

The YINCAE® SMT158 capillary underfill is a combination of capillary flow and no-flow underfill, rapid curing, fast flowing liquid epoxy which can be used as a underfill for chip scale package, ball grid array devices, package on package and land grid array and some flip chip applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is environmentally friendly, and designed for high production where process speed and mechanical shock are the key concerns.

 

Several products are available in the series, each is formulated to meet specific product design parameters. SMT88UH is an adhesive, which can be underfilled at room temperature without preheating a substrate. After cure, the underfilll is void free. WL125 is a pre-applied wafer-level underfill, which is designed for wafer-to-wafer, chip to wafer, chip to chip, and chip to substrate application, particularly for 3-10μ bumped wafer. All products in this series provide a perfect solution for customers looking to strengthen the underfilling process in a 100% reworkable manner.

Products Application Note

Data Sheets for YINCAE products available upon request.

 

Scan the QR code or text "YINCAE" to 22828 to join our email list!

Join Our Email List

© 2017 YINCAE Advanced Materials, LLC - All Rights Reserved

19 Walker Way, Albany, NY, 12205

Info@yincae.com

518-452-2880

PROUD SUPPORTER: