Wafer Level Materials

 

 

YINCAE's ACP 120 series is an excellent option for customers looking for an anti- oxidation coating for solderable and metal surfaces such as zinc, nickel, steel, aluminum, and more. Features include excellent anti-oxidation performance and adhesion, excellent anti-corrosion and anti-rusting, high thermal resistance, room temperature drying, and easy rework when wet. Some highlights are: • Eliminates Gold Plating Process • Low Cost Ownership • Environmentally Friendly • High Throughput • Reworkable Process • Large Process Window ACP 120 can be customized to meet customer requirements. Our WL 66 series are UV curable optical lid attachment adhesives designed for wafer level lens and optical lens attachment. They provide a bubble free optical coverage, high moisture resistance, and high temperature resistance. The product also remains transparent and does not 'yellow'. Product Application Notes
Data Sheets for YINCAE products available upon request



BREAKING NEWS: YINCAE Wins Global Technology Award

iMAPS New England 46th Symposium & Expo, May 7. Boxboro, MA.

iMAPS 2019 52nd Symposium on Microelectronics, October 1-3. Boston, MA.

 

 

Upcoming Events

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iMAPS New England 2019 May 7th Boxboro Regency Hotel Boxborough, MA iMAPS Boston 2019 October 1st-3rd Hynes Convention Center

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