Wafer Level Materials

 

 

Our ACP 120 series is an excellent option for customers looking for an anti-

oxidation coating for solderable and metal surfaces such as zinc, nickel, steel, aluminum, and more. Features include excellent anti-oxidation performance and adhesion, excellent anti-corrosion and anti-rusting, high thermal resistance, room temperature drying, and easy rework when wet. Some highlights are:

 

• Eliminates Gold Plating Process

• Low Cost Ownership

• Environmentally Friendly

• High Throughput

• Reworkable Process

• Large Process Window

 

ACP 120 can be customized to meet customer requirements.

 

Our WL 66 series are UV curable optical lid attachment adhesives designed for wafer level lens and optical lens attachment. They provide a bubble free optical coverage, high moisture resistance, and high temperature resistance. The product also remains transparent and does not 'yellow'.

 

 

Products Application Note

Data Sheets for YINCAE products available upon request.



BREAKING NEWS: YINCAE Wins Global Technology Award

IPC Apex 2018, February 27 - March 1. San Diego, CA. Booth #2732

SEMICON WEST 2018, July 11 - 13. San Francisco, CA. Booth #5296

IWLPC 2018, October 24 - 26. San Francisco, CA.

 

 

Upcoming Events

 IPC APEX 2018 February 27th - March 1st San Diego Convention Center Booth # 2732 San Diego, CA SEMICON West 2018 July 11 - 13 Moscone Center, North Hall Booth # 5269 San Francisco, CA

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19 Walker Way, Albany, NY, 12205

Info@yincae.com

518-452-2880

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