BREAKING NEWS! YINCAE receives ISO 9001:2015 Certification

YINCAE Releases World's First Commerically Available Diamond Filled underfill ( Jan. 18/21)

YINCAE Releases A New Underfill Withstanding -273 Degree Celsius (Feb. 11/21)!

 

10/23/2019

YINCAE Advanced Materials to Exhibit at SMTA Mexico Expo 2019

 

10/1/2019

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

 

8/19/2019

YINCAE’s New NC 256 Zero Residue Flux!

 

5/7/2019

YINCAE Advanced Materials to Exhibit and Present at IMAPS New England Symposium & Expo 2019

 

7/16/2019

YINCAE receives ISO 9001:2015 Certification

 

7/15/2019

Yincae to Exhibit at IMAPS Boston 2019

09/24/2018

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

05/18/2018

SMT 158A Receives High Praise

05/11/2018

New Highly Conductive Thermal Underfill: SMT 158D

03/29/2018

SEMICON West is 2 Months Away! Visit YINCAE at Booth 5269

02/06/2018

IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

01/03/2018

Low Temperature Reflowable Underfill Material: SMT 160L

10/19/2017

YINCAE's New Molded Underfill for Flip Chip Applications: MUF 158

10/25/2017

YINCAE's New Reflowable Underfill Material: SMT 160

12/04/2017

IPC APEX 2018 is 2 months away! Visit YINCAE at Booth 2732

06/22/2016

SEMICON IS ONLY 2 WEEKS AWAY

Visit YINCAE Booth 6448

4/27/2016

ECTC in Las Vegas is 1 Month Away!

VISIT YINCAE BOOTH 506 AT ECTC 2016

4/25/2016

IMAPS NE 2016 IS NEXT WEEK!

VISIT YINCAE BOOTH 101 AT IMAPS NE 2016

4/8/2016

IMAPS NE 2016 is 1 Month Away!

VISIT YINCAE BOOTH 101 AT IMAPS NE 2016

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