BREAKING NEWS: YINCAE Wins Global Technology Award

SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416

 

  Stand-off Height of Solder Joints

 

 

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

  Pull Strength of Solder Joints

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

  Weibull Plot of Thermal Cycling Failure

     Using Solder Joint Encapsulant

 Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle.

 

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