Stand-off Height of Solder Joints

 

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

  Pull Strength of Solder Joints

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

  Weibull Plot of Thermal Cycling Failure

     Using Solder Joint Encapsulant

 Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle.



BREAKING NEWS: YINCAE Wins Global Technology Award

IPC Apex 2018, February 27 - March 1. San Diego, CA. Booth #2732

SEMICON WEST 2018, July 11 - 13. San Francisco, CA. Booth #5296

IWLPC 2018, October 24 - 26. San Francisco, CA.

 

 

 

Upcoming Events

 IPC APEX 2018 February 27th - March 1st San Diego Convention Center Booth # 2732 San Diego, CA SEMICON West 2018 July 11 - 13 Moscone Center, North Hall Booth # 5269 San Francisco, CA

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