For Tin/Lead and Lead Free Ball Attachment
Wide Process Window
Eliminates Underfill Materials and Process
Enhances Solder Strength 5-10x
Low Cost Ownership
► Stand-off Height of Solder Joints
Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.
► Pull Strength of Solder Joints
Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.
► Weibull Plot of Thermal Cycling Failure
Using Solder Joint Encapsulant
Thermal Cycling Conditions: SAC305; I/O 1156; -55°C~150°C; 1h/cycle.