Stand-off Height of Solder Joints

 

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

  Pull Strength of Solder Joints

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

  Weibull Plot of Thermal Cycling Failure

     Using Solder Joint Encapsulant

 Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle.



BREAKING NEWS: YINCAE Wins Global Technology Award

iMAPS New England 46th Symposium & Expo, May 7. Boxboro, MA.

iMAPS 2019 52nd Symposium on Microelectronics, October 1-3. Boston, MA.

 

 

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