Stand-off Height of Solder Joints

 

Solder Joint Encapsulant provides better soldering wetting in air reflow than tacky flux in the Nitrogen reflow.

  Pull Strength of Solder Joints

Solder Joint Encapsulant enhance solder joint strength 5x, and smaller standard deviation than tacky flux.

  Weibull Plot of Thermal Cycling Failure

     Using Solder Joint Encapsulant

 Thermal Cycling Conditions:  SAC305; I/O 1156; -55°C~150°C; 1h/cycle.



BREAKING NEWS: YINCAE Wins Global Technology Award

IWLPC 2018, October 23 - 24. San Jose, CA. Booth #47

IPC APEX Expo 2019, January 29 - 31. San Diego, CA. Booth #1720

 

Upcoming Events

Innovative Leaders

Open The Door For: Innovative leaders • 35+ years’ experience • Worldwide support • Award winning company • Premier products
IWLPC 2018 October 23rd - 24th DoubleTree by Hilton San Jose Booth # 47 San Jose, CA IPC APEX Expo 2019 January 29th - 31st San Diego Convention Center Booth #1720 San Diego, CA

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