•Which underfill materials are designed for board level applications?
YINCAE SMT 88 series underfills and SMT 158UL
•Which underfill materials are designed for package level applications?
YINCAE SMT 158 and SMT 158HA series capillary underfills
•Which underfill materials are designed for wafer level applications?
YINCAE WL 125 series wafer level underfills
•What are the benefits of YINCAE SMT 158 series underfills?
1. Nano underfill
2. Fast cure option
3. No resin bleeding
4. Full compatibility with lead-free processes
5. Good for narrow gap underfilling
6. High reliability
•What are the benefits of YINCAE SMT 88 series underfills?
1. Room temperature underfilling
2. Fast flow
3. Fast low temperature cure
4. High reliability
5. Friendly storage conditions
6. Easy rework
•Does YINCAE offer thermally conductive underfill materials?
Yes, YINCAE offers three thermally conductive underfill materials
1. SMT 158A
2. SMT 158D – Diamond filled
3. SMT 158FB7
•Does YINCAE offer underfills designed for specific applications (i.e. thermal management, capillary, non-flow…)?
Yes, YINCAE offers a wide range of underfills including:
1. Board level capillary underfill
2. Package level capillary underfill
3. Non-flow underfill
4. Reflowable underfill
5. Thermal underfill
•Does YINCAE offer underfills with a wide range of options (C.T.E, color, viscosity…)?
Yes, contact us with material requirements and we can send product information.
•Does YINCAE offer permanent underfills?
Yes, our SMT 158 and SMT 158HA series underfills are permanent
•Does YINCAE offer reworkable underfills?
Yes, our SMT 88 series underfills and SMT 158UL, are reworkable
•Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE underfill materials available?
•What is SMT 160?
SMT 160 is a recently developed unfilled reflowable (no – flow) underfill.
•What are reflowable (no – flow) underfills?
Reflowable (no – flow) underfills, such as SMT 160, are underfill materials that do not flow away from areas where they are applied. This allows users to apply (print or dispense) the no – f low underfill material and place the component in a subsequent step. They are especially useful for applications which have a small footprint.
•What are the benefits of YINCAE reflowable (no-flow) underfills?
YINCAE reflowable (no – flow) underfill materials are designed to:
• Eliminate capillary underfills
• Simplify the assembly process
• Combine underfilling and soldering in the SMT processes
• Increase throughput
• Reduce costs
YINCAE reflowable (no – flow) underfill materials also provide high reliability and can eliminate voids.
•How many reflowable (no – flow) underfill materials are available from YINCAE?
YINCAE offers three reflowable (no – flow) underfills
1. SMT 160 – unfilled, reflowable underfill, compatible with typical Pb – free reflow profiles
2. SMT 160L – unfilled, reflowable underfill, compatible with typical low temperature Pb – free reflow profiles
3. SMT 158R – filled, reflowable underfill, compatible with typical Pb – free reflow profiles
•What type of applications would an unfilled and filled underfill be used for?
Unfilled underfills are designed for board – level applications as well as applications with no C.T.E. mismatch. They are also easy to rework.
Filled underfills are designed for package level and wafer level applications as well as applications with significant C.T.E. mismatch. Filled underfills are generally difficult to rework.