•Which underfill materials are designed for board level applications?
YINCAE SMT 88 series underfills and SMT 158UL
•Which underfill materials are designed for package level applications?
YINCAE SMT 158 and SMT 158HA series capillary underfills
•Which underfill materials are designed for wafer level applications?
YINCAE WL 125 series wafer level underfills
•What are the benefits of YINCAE SMT 158 series underfills?
1. Nano underfill
2. Fast cure option
3. No resin bleeding
4. Full compatibility with lead-free processes
5. Good for narrow gap underfilling
6. High reliability
•What are the benefits of YINCAE SMT 88 series underfills?
1. Room temperature underfilling
2. Fast flow
3. Fast low temperature cure
4. High reliability
5. Friendly storage conditions
6. Easy rework
•Does YINCAE offer thermally conductive underfill materials?
Yes, YINCAE offers three thermally conductive underfill materials
1. SMT 158A
2. SMT 158D – Diamond filled
3. SMT 158FB7
•Does YINCAE offer underfills designed for specific applications (i.e. thermal management, capillary, non-flow…)?
Yes, YINCAE offers a wide range of underfills including:
1. Board level capillary underfill
2. Package level capillary underfill
3. Non-flow underfill
4. Reflowable underfill
5. Thermal underfill
•Does YINCAE offer underfills with a wide range of options (C.T.E, color, viscosity…)?
Yes, contact us with material requirements and we can send product information.
•Does YINCAE offer permanent underfills?
Yes, our SMT 158 and SMT 158HA series underfills are permanent
•Does YINCAE offer reworkable underfills?
Yes, our SMT 88 series underfills and SMT 158UL, are reworkable
•Is more information (i.e. TDS, additional material options, brochures…) regarding YINCAE underfill materials available?