"Solder Joint Encapsulant Adhesive - POP Assembly Solution"  paper was presented by Dr. Wusheng Yin in NEPCON, Shenzhen, China August 29, 2012

Watch the interview here.

"Gold Replacement - Nanofilm for Oxidation Barrier"  paper was presented by Dr. Wusheng Yin in IMAPS, Nano Center, Albany, New York, June 14, 2012

"A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive"  paper was presented by Dr. Wusheng Yin in IMAPS, Long Beach, California, October 9-13, 2011

"A Low Cost and High Thermal Conductive Solderable  Adhesive"  paper was presented by Dr. Wusheng Yin in IMAPS, Long Beach, California, October 9-13, 2011

 "Innovative Rework Solution to Assembled IC Components" paper was presented by Dr. Wusheng Yin in SMTA International Conference, Fort Worth, Texas, Oct. 12-20, 2011

 "A Novel Low Temperature Fast Flow and Fast Cure Reworkable Underfill" paper was presented by Dr. Wusheng Yin in SMTA International Conference, Fort Worth, Texas, Oct, 12-20, 2011

 "A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure And Flow Reworkable Underfill" paper was presented by Dr. Wusheng Yin  in San Fancisco, SEMICON West/IMAPS, July 13, 2011

Dr. Wusheng Yin presented "A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive" in IMAPS New England - 38th Symposium & Expo, May 3, 2011

Dr. Wusheng Yin presented "A Low Cost and High Thermal Conductive Solderable  Adhesive" in IMAPS New England - 38th Symposium & Expo, May 3, 2011

Dr. Wusheng Yin presented "Underfill for Ultra-low Bumped (10u) 3D TSV package" in Raleigh NC, IMAPS, November 4, 2010

Dr. Wusheng Yin had technical poster "A First Individual Solder Joint Encapsulant Adhesives" in Raleigh NC, IMAPS, November 3, 2010

Dr. Wusheng Yin Presented "World First Solder Joint Encapsulant Adhesives"  in Shenzhen (China), NEPCON, August 31, 2010

Dr. Wusheng Yin presented "A First Individual Solder Joint Encapsulant Adhesives" in San Francisco, SEMICON West/IMAPS, July 14, 2010