{"id":506,"date":"2021-03-16T00:54:35","date_gmt":"2021-03-16T00:54:35","guid":{"rendered":"https:\/\/yincae.com\/?page_id=506"},"modified":"2025-03-03T01:47:24","modified_gmt":"2025-03-03T01:47:24","slug":"white-paper","status":"publish","type":"page","link":"https:\/\/yincae.com\/index.php\/white-paper\/","title":{"rendered":"White Paper"},"content":{"rendered":"\t\t
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white papers<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\u25ba Zero Outgassing and Flux Residue Compatibility Underfill May 7th, IMAPS\u00a0<\/a>New England 2019<\/span><\/p><\/div><\/div>

\u25ba High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives\u00a0<\/span><\/a>October 10th, IMAPS International Symposium Microelectronics, 2017<\/span><\/span><\/p><\/div>

\u25ba\u00a0<\/span><\/a>High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste\u00a0<\/span><\/a>September 19th, SMTA International, 2017<\/span><\/span><\/p><\/div>

\u25ba Room Temperature Fast Flow Reworkable Underfill for LGA May 3rd, IMAPS New England 2016<\/a><\/span><\/p><\/div>

\u25ba Underfill for Ultra-Low Bumped (10\u00b5) 3D Package (WP-1012-02\/2016)<\/a><\/span><\/p><\/div>

\u25ba A High Thermal Conductive Solderable Adhesive (WP-1011-01\/2016)<\/span><\/a><\/span><\/p><\/div>

\u25ba A Low Cost Manufacturing Solution – Low Temperature Super-Fast Cure and Flow Reworkable Underfill (WP-1010-01\/2016)<\/span><\/a><\/span><\/p><\/div>

\u25ba A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive – Capillary Underfill Replacement (WP-1009-01\/2016)<\/span><\/a><\/span><\/p><\/div>

\u25ba The Future of Solder Joint Encapsulant\u00a0<\/span><\/a>October 29th, IMAPS 2015<\/span><\/span><\/p><\/div>

\u25ba A Lower Temperature Solder Joint Encapsulant For Sn\/Bi Applications\u00a0<\/span><\/a>September 29th, SMTAI 2015<\/span><\/span><\/p><\/div>

\u25ba Solderable Anisotropic Conductive Adhesives For 3D Package Applications\u00a0<\/span><\/a>October 21st, International Symposium on Microelectronics 2014<\/span><\/span><\/p><\/div>

\u25ba An Innovative Reliability Solution to Interconnect of Flexible\/Rigid Substrates\u00a0<\/span><\/a>Ocotber 9th, SMTAI, 2014<\/span><\/span><\/p><\/div>

\u25ba Solder joint encapsulant adhesive – LGA high reliability and low cost assembly solution (WP-1004-04\/2014)<\/span><\/a><\/span><\/p><\/div>

\u25ba Solder joint encapsulant adhesive POP assembly solution (WP-1003-03\/2014)<\/span><\/a><\/span><\/p><\/div>

\u25ba Solder joint encapsulant adhesive POP TMV high reliability and low cost assembly solution (WP-1002-03\/2014)<\/span><\/a><\/span><\/p><\/div>

\u25ba A novel low temperature fast flow and fast cure reworkable underfill (WP-1001-01\/2014)<\/span><\/a><\/span><\/p><\/div>

\u25ba A novel high thermal conductive underfill for flip chip application<\/span><\/a>\u00a0October 1-3rd, IMAPS 2013<\/span><\/span><\/p><\/div>

Presentations<\/strong><\/span><\/p><\/div>

\u25ba Zero Outgassing and Flux Residue Compatibility Underfill May 7th, IMAPS\u00a0<\/a>New England 2019<\/span><\/p><\/div>

\u25ba High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives\u00a0<\/span><\/a>October 10th, IMAPS International Symposium Microelectronics, 2017<\/span><\/span><\/p><\/div>

\u25ba\u00a0<\/span><\/a>High Reliability and High Temperature Application Solution – Solder Joint Encapsulant Paste\u00a0<\/span><\/a>September 19th, SMTA International, 2017<\/span><\/span><\/p><\/div>

\u25ba Room Temperature Fast Flow Reworkable Underfill for LGA May 3rd, IMAPS New England 2016<\/a><\/span><\/p><\/div>

\u25ba Underfill for Ultra-Low Bumped (10\u00b5) 3D Package (WP-1012-02\/2016)<\/a><\/span><\/p><\/div>

\u25ba A High Thermal Conductive Solderable Adhesive (WP-1011-01\/2016)<\/span><\/a><\/span><\/p><\/div>

\u25ba A Low Cost Manufacturing Solution – Low Temperature Super-Fast Cure and Flow Reworkable Underfill (WP-1010-01\/2016)<\/span><\/a><\/span><\/p><\/div>

\u25ba A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive – Capillary Underfill Replacement (WP-1009-01\/2016)<\/span><\/a><\/span><\/p><\/div>

\u25ba<\/span>\u00a0“The Future of Solder Joint Encapsulant Adhesives,” October 29th, IMAPS 2015<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A Lower Temperature Solder Joint Encapsulant for Sn\/Bi Applications,” September 29th, SMTAI 2015<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“An Overview of Advanced Materials,” May 27th, ECTC 2015<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“The Future of Solder Joint Encapsulant Adhesives,” February 23rd, IPC APEX EXPO 2015<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“The Future of Solder Joint Encapsulation,” March 20th, IMAPS New England Expo 2015<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“The Future of Solder Joint Encapsulation,” October 24th, IPC Tech Summit 2014<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“Solderable Anisotropic Conductive Adhesives for 3D Package Applications,” October 21st, International Symposium on Microelectronics 2014<\/span><\/p><\/div>

\u25ba\u00a0<\/span>“An Innovative Reliability Solution to Interconnect of Flexible\/Rigid Substrates,” October 9th, SMTAI 2014<\/span><\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A High Thermal Conductive Solderable Adhesive,” April 30th, IMAPS Workshop at CNSE, 2014<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“Solder Joint Encapsulate – Miniaturization Solution,” March 25-27th, APEX 2014<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A Novel High Thermal Conductive Underfill for Flip Chip Application” and “Solder Joint Encapsulant Adhesive – LGA High Reliability and Low Cost Assembly Solutions,” October 1st-3rd, IMAPS 2013<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A Novel Underfill for 3D TSV Package” and “Solder Joint Encapsulate Adhesive – PoP TMV High Reliability and Low Cost Assembly Solution,” April 30th-May 1st, IMAPS workshop 2013<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“Solder Joint Encapsulant Adhesive – PoP Assembly Solution,” August 29th, NEPCON 2012<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“Gold Replacement – Nanofilm for Oxidation Barrier,” June 14th, IMAPS workshop 2012<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“Innovative Rework Solution to Assembled IC Components,” October 12-20th, SMTA 2011<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive” and “A Low Cost and High Thermal Conductive Solderable Adhesive,” October 9-13th, IMAPS 2011<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A Low Cost Manufacturing Solution – Low Temperature Super-Fast Cure and Flow Reworkable Underfill,” July 13th, SEMICON West 2011<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A First Room Temperature Stable and Jettable Solder Joint Encapsulant Adhesive” and “A Low Cost and High Thermal Conductive Solderable Adhesive,” May 3rd, IMAPS 2011<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“Underfill for Ultra-Low Bumped (10u) 3D TSV Package” and “A First Individual Solder Joint Encapsulant Adhesives,” November 3rd-4th, IMAPS 2010<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“World First Solder Joint Encapsulant Adhesives,” August 31st, NEPCON 2010<\/span><\/p><\/div>

\u25ba<\/span>\u00a0“A First Individual Solder Joint Encapsulant Adhesives,” July 14th, SEMICON West 2010<\/span><\/p><\/div>

Technical Poster<\/strong><\/span><\/p><\/div>

\u25ba “<\/span>A First Individual Solder Joint Encapsulant Adhesives,” IMAPS 2010<\/span><\/p><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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