YINCAE Product Catalog (YPC-001-03/2014)

YINCAE Product Solutions Tri-fold Brochure (YPB-001-03/2014)


A novel high thermal conductive underfill for flip chip application (WP-1000-03/2013)

A novel low temperature fast flow and fast cure reworkable underfill (WP-1001-01/2014)

Solder joint encapsulant adhesive POP assembly solution (WP-1003-03/2014)

Solder joint encapsulant adhesive POP TMV high reliability and low cost assembly solution (WP-1002-03/2014)


SMT256 Application Process



BREAKING NEWS: YINCAE Wins Global Technology Award

SEMICON WEST 2018, July 11 - 13. San Francisco, CA. Booth #5269

IWLPC 2018, October 23 - 24. San Jose, CA. Booth #47


Upcoming Events

Innovative Leaders

Open The Door For: Innovative leaders • 35+ years’ experience • Worldwide support • Award winning company • Premier products
SEMICON West 2018 July 11th - 13th Moscone Center, North Hall Booth # 5269 San Francisco, CA IWLPC 2018 October 23rd - 24th DoubleTree by Hilton San Jose Booth # 47 San Jose, CA

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