SMT 88UH Fast Cure, Reworkable Underfill
(Albany, NY) July 7, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.
Advantages of the SMT 88UH include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Another great benefit is the fact that it can be stored in a regular refrigerator or freezer. You do not need a specialized freezer to store the SMT 88UH because of its friendly storage conditions.
SMT 88UH is a very versatile underfill. It can be used for more than just underfilling. It can be used for chip scale packaging, ball grid array devices, package on package, land grid array, and certain flip chip applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.
Additional information on the SMT 88UH is available on our Website at http://yincae.com/board-level-assembly.html or by contacting YINCAE at firstname.lastname@example.org.
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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.
FOR ADDITIONAL INFORMATION CONTACT:
YINCAE Advanced Materials, LLC
19 Walker Way
Albany, NY 12205
Phone: (518) 452-2880
* The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.
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