WORLD'S FIRST SUPER FAST LOW TEMPERATURE UNDERFILL
(Albany, NY) June 30, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
SMT 88 is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance.
SMT 88 can be used not only as an underfill for chip scale packaging, but also on ball grid array devices, package on package, land grid array, and certain flip chip applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. SMT 88 is also available at a higher viscosity if it is needed.
Additional information on the product series is available on our Website at http://yincae.com/board-level-assembly.html or by contacting YINCAE at email@example.com.
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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.
FOR ADDITIONAL INFORMATION CONTACT:
YINCAE Advanced Materials, LLC
19 Walker Way
Albany, NY 12205
Phone: (518) 452-2880
* The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.
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