An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

 

(Albany, NY)  July 25, 2014.  Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

 

          Increasing miniaturization in the electronic industry is a trend that can clearly be seen as time continues to move forward. The strength of solder joint or interconnects presents a challenging issue as it becomes more difficult to meet customers’ requirements. Underfilling the interconnects of rigid/flexible substrates does not solve the problem. Solder joint encapsulant adhesive (SMT266) provides a reliable solution to the interconnect of rigid/flexible substrates. Using solder joint encapsulant adhesive not only doubles the strength of the interconnect compared to using traditional flux, but also ensures 100% manufacturing process yield. Solder joint encapsulant adhesive is used in line process, thus shortening the manufacturing process. The SMT 266 solder joint encapsulant adhesive provides a solution to all problems that miniaturization can cause.

 

          If you would like to read the full white paper on “An Innovation Reliability Solution Interconnect of Flexible/Rigid Substrates” just click the following link; http://www.yincae.com/assets/white-paper-july2014-1.pdf

 

          Additional information on the product series is available on our Website at http://www.yincae.com/products.html or by contacting YINCAE at info@yincae.com.

 

 

                                             * * * * * * * *

YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

 

FOR ADDITIONAL INFORMATION CONTACT:

Tech Support

YINCAE Advanced Materials, LLC

19 Walker Way

Albany, NY  12205

Phone: (518) 452-2880

E-mail: techsupport@yincae.com

 

                                                    ###

 

* The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

 

 

 

 



BREAKING NEWS: YINCAE Wins Global Technology Award

IPC Apex 2018, February 27 - March 1. San Diego, CA. Booth #2732

SEMICON WEST 2018, July 11 - 13. San Francisco, CA. Booth #5296

IWLPC 2018, October 24 - 26. San Francisco, CA.

 

Upcoming Events

 IPC APEX 2018 February 27th - March 1st San Diego Convention Center Booth # 2732 San Diego, CA SEMICON West 2018 July 11 - 13 Moscone Center, North Hall Booth # 5269 San Francisco, CA

Innovative Leaders

Open The Door For: Innovative leaders • 25+ years’ experience • Worldwide support • Award winning company • Premier products

Scan the QR code or text "YINCAE" to 22828 to join our email list!

Join Our Email List

© 2017 YINCAE Advanced Materials, LLC - All Rights Reserved

19 Walker Way, Albany, NY, 12205

Info@yincae.com

518-452-2880

PROUD SUPPORTER: