YINCAE President to be a IPC Keynote Speaker


Dr. Wusheng Yin, President of YINCAE Advanced Materials, LLC has been invited to be a Keynote Speaker at the IPC TechSummit, October 28–30, 2014 in Raleigh, NC. According to IPC, “the event will focus on innovation, reliability and leadership — three cornerstones of successful business in today’s electronics marketplace.”


In his keynote presentation - The Future of Solder Joint Encapsulant Adhesives, Dr. Yin will discuss the use of solder joint encapsulant adhesives and their future relative to improving solder joint strength, a major manufacturing challenge as the microelectronics industry moves towards smaller devices with smaller contact points.


Dr. Yin is a pioneer in the field of encapsulant adhesives and has developed several encapsulant products that have been successfully adopted by major microelectronics product and contract manufacturers. His encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity and thermocycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength 5 times while reducing thermal cycling failures 10 times, with a reduction in solder voids of up to 79%. This data translates to significant production savings for microelectronics manufacturers.


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IPC — Association Connecting Electronics Industries® is a global trade association. Since 1957, IPC has been guiding the electronic interconnection industry and is dedicated to furthering the competitive excellence and financial success of its membership.


YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.



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YINCAE Advanced Materials, LLC

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