YINCAE Discusses Advanced Product Technologies at IMAPS Workshop and Exhibition


YINCAE Advanced Materials, LLC presented a technical session on its TM150 and TM230 High-Thermal Conductive Solderable Adhesives at the International Microelectronics Assembly and Packaging Society (IMAPS) Workshop and Exhibition at the College of Nanoscale Science and Engineering (CNSE) Nano Tech Complex in Albany, New York USA.  The focus of the workshop was on "Packaging the Next Generation of Nano Devices, and the unique challenges of emerging 3D, 2.5D, silicon carrier, MEMs, and Hybrid-electro-opto packages.


YINCAE's session identified the specific  product performance characteristics and benefits  of their TM150/TM230 products.  These products are highly suited for emerging industry needs and can be used as die attach adhesives for LED, CSP, QFP and similar applications.  TM150/230 Solderable Adhesives were designed to combine the advantages of traditional pure solder materials and silver adhesives while overcoming some major disadvantages of solder and silver which include costly high failure rates due to higher processing temperature requirements.


YINCAE's TM150/TM230 products have higher thermal conductivity than pure solder alloys.  They also have a lower process temperature, and higher application temperature and unlike solder paste or preform, can be used for bare die attachment.  They can be self-filled and self-level the gap between the die and the metal surface during soldering and curing and can eliminate the out-gassing issue during soldering as well as the need for a cleaning process after soldering.  The products can be applied using the dispense, print or pin transfer methods.


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The CNSE Nano Tech Complex is a major international nanotechnology development and technology deployment resource.  Since its inception in 2004, CNSE has gained worldwide recognition as a leader and pioneer in nanotechnology education, innovation and  industry outreach.


YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.



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