48th IMAPS 2015 Announcement
VISIT YINCAE BOOTH 409 AT IMAPS 2015
(Albany, NY) August 31, 2015 – Dr. Wusheng Yin, the president of YINCAE Advanced Materials LLC, is going to be speaking at the upcoming 48th IMAPS 2015 conference. IMAPS 2015 will take place from October 27th to 29th. It will be held at Rosen Centre Hotel in Orlando, FL.
Dr. Yin will be presenting his white paper, “The Future of Solder Joint Encapsulant Adhesives.” This paper will focus on the use of solder joint encapsulant adhesives and their future relative to improving solder joint strength (5-10X), reducing costs, and shortening the manufacturing process by eliminating the need for underfill. All these areas are of extreme importance as the microelectronic industry moves towards miniaturization of products. The presentation will be Thursday, Oct 29th from 9-9:25am.
YINCAE Advanced Materials, LLC hopes that you will come join us at the conference to learn about YINCAE and the products that we have to offer. YINCAE has exclusive products that no other company has developed. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from IMAPS 2015 as a whole. YINCAE hopes to see you there at the conference. Please visit us at booth 409!
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.