YINCAE To Present at IMAPS Workshop at the College of Nanoscale Science and Technology and Engineering (CNSE) in Albany NY

YINCAE Advanced Materials, LLC located in Albany New York will present  the paper "A High Thermal Conductive Solderable Adhesive" at the regional International Microelectronics Assembly and Packaging Society (IMAPS) workshop on April 30, 2014.  YINCAE will address the thermal issues related to attaching LED devices to components and substrates, in particular in applications employing high-powered devices as well as other drawbacks associated with using the current industry standard which is the gold alloy Au80Sn20.


LED devices are becoming more attractive for commercial and residential lighting due to the desire for green energy products.  One of the challenges associated with high-power LEDs is the quick and efficient dissipation of heat from the high-power LED and attached high-power chip. This issue is compounded by the trend towards miniaturization of electronic devices.


YINCAE will discuss research findings on YINCAE's TM 230 Series Solderable Adhesives.     The TM 230 Series are thermally and electrically conductive adhesives that have higher stable electrical and thermal conductivity than the Au80Sn20 currently in use. The product has demonstrated higher thermal conductivity than pure solder alloy, lower process temperature, and higher application temperature, and eliminate the out-gassing issue for soldering and cleaning process after soldering.


The IMAPS Workshop will feature technical sessions, dedicated exhibit hall times, and various networking opportunities and runs from 12 pm to 7 pm featuring “Packaging the Next Generation of Nano Devices."  The Workshop and Exhibition will be held at the College of Nanoscale Science and Engineering (CNSE), NanoFab South Rotunda and Auditorium, 257 Fuller Road, Albany, NY.  More workshop details are available at http://www.imaps.org/Nano/exhibits2014.htm.


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YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.




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