BREAKING NEWS: YINCAE Wins Global Technology Award

SMTA International 2017, September 19-20. Rosemont, IL. BOOTH 329

IMAPS 50th Anniversary Symposium 2017, October 10-11. BOOTH 416


An ECTC Special Presentation by Dr. Wusheng Yin

 An Overview of Advanced Materials

(Albany, NY) May 8, 2015 We at YINCAE Advanced Materials, LLC would like to cordially invite you to a special presentation, An Overview of Advanced Materials by Dr. Wusheng Yin; our President. YINCAE develops and manufactures a wide range of materials including:


  •  Solder Joint Encapsulants
  •  Underfill Materials
  •  Die Attach Adhesives
  •  Conformal Coatings
  •  Nano Composite Formulations
  •  Wafer Level Materials
  •  Optoelectronic Material
  •  Thermal Interface Material


YINCAE offers a variety Adhesives, Thermal Interface, and Chip/ Board/ Packaging level materials for any level of necessity. Dr. Yin created the WORLD's FIRST Lead -Free Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications with differential chemistry and electrical/ thermal conductivity for your individualized needs.


Date: Wednesday, May 27 2015

Time: 1:00pm-3:00 pm

Location: Sheraton Hotel (4th Floor- Rooms 411/415) on-site of the ECTC 2015 Conference.


For more information or if you have any questions please feel free to contact the Administrative Office: or 518-452-2880. We look forward to seeing you there..










Press-Release PDF




Scan the QR code or text "YINCAE" to 22828 to join our email list!

Join Our Email List

© 2017 YINCAE Advanced Materials, LLC - All Rights Reserved

19 Walker Way, Albany, NY, 12205