YINCAE To Exhibit at ECTC 2016

Come visit us at booth 506!

 

ECTC 2016

VISIT YINCAE BOOTH 506

 

(Albany, NY) February 21, 2016. YINCAE Advanced Materials LLC is excited to announce that we will be exhibiting at the upcoming event ECTC 2016! This year, ECTC will take place from May 31st to June 3rd at the Cosmopolitan Hotel in Las Vegas, Nevada. As we prepare for the upcoming event, we hope that you are looking to attend the show as well. Come by our booth 506 and take one of our convenient tri-folds, learn more about the array of products we have available, and ask us any questions that you may have. The YINCAE team hopes that you will be attending the show, and stop by to learn more about YINCAE and the innovative products that we have to offer!

 

The ECTC (Electronics Components and Technology Conference) is an international event that showcases the best in packaging, component, and microelectronic systems, science, technology and education in an environment of cooperation and technical exchange.

 

YINCAE Advanced Materials LLC is in the field of encapsulant adhesives and has developed several encapsulant products that have been successfully adopted by major microelectronics products and contract manufacturers.  Our encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity, and thermocycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by 5 times while reducing thermal cycling failures by 10 times, with a reduction in solder voids of up to 79%.  This data translates to significant production savings for microelectronics manufacturers. YINCAE has unique and exclusive products that no other company has developed. There is a lot that can be taken away from not only our booth and products, but from the ECTC 2016 conference as a whole. YINCAE hopes to see you there at the ECTC 2016 show. Please visit us at booth 506!

 

For more information, please visit our website: www.yincae.com

 

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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 

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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

 

 



BREAKING NEWS: YINCAE Wins Global Technology Award

IPC Apex 2018, February 27 - March 1. San Diego, CA. Booth #2732

SEMICON WEST 2018, July 11 - 13. San Francisco, CA. Booth #5296

IWLPC 2018, October 24 - 26. San Francisco, CA.

 

Upcoming Events

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